Wafer Manufacturing (Level II)

Description

Benefits

Electric-Assisted Mobility: Smooth, effortless movement with the option for manual operation.

Lightweight yet Strong: Aluminum construction reduces weight while maintaining durability.

Precision Lifting: Roller screw mechanism ensures stable and accurate elevation.

Safety-Oriented: Electrical mutual lock prevents accidental operation.

Customizable Configuration: Can be tailored to specific production or workflow requirements.

Cleanroom Ready: Designed for wafer manufacturing and semiconductor production environments.

Product Applicability

Perfect for semiconductor fabrication, wafer handling, and precision cleanroom operations, ensuring efficient, safe, and accurate material handling in advanced manufacturing settings.

Wafer Manufacturing (Level II)

The Wafer Manufacturing (Level II) platform is a high-precision lifting and transport solution tailored for semiconductor and wafer production environments. With a load capacity of 137kg and a lifting height of 2810mm, it features a lightweight aluminum body and electric-assisted movement, which can also switch to manual operation for flexibility. The roller screw promotion system ensures smooth and accurate lifting, while the electrical safety interlock provides reliable operational safety. This system is ideal for cleanroom workflows, efficiency offering, stability, and adaptability to specific manufacturing needs.

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